4.1. Equipment and devices specially designed to initiate explosions by electrical or non-electrical means, including firing sets, detonators, igniters, boosters and detonating cord, and specially designed components therefor; except those specially designed for a specific commercial use consisting of the actuation or operation by explosive means of other equipment or devices the function of which is not the creation of explosions (e.g., car air-bag inflaters, electric-surge arresters of fire sprinkler actuators);

4.2. Linear cutting explosive charges not controlled by the Common Military List;

4.3. Other explosives not controlled by the Common Military List and related substances as follows:
a. amatol;
b. nitrocellulose (containing more than 12,5 % nitrogen);
c. nitroglycol;
d. pentaerythritol tetranitrate (PETN);
e. picryl chloride;
f. 2,4,6-trinitrotoluene (TNT).

5.Protective equipment not controlled by ML 13 of the Common Military List as follows:

5.1. Body armour providing ballistic and/or stabbing protection;

5.2. Helmets providing ballistic and/or fragmentation protection, anti-riot helmets, antiriot shields and ballistic shields. Note: This item does not control:
— equipment specially designed for sports activities,
— equipment specially designed for safety of work requirements,

6.Simulators, other than those controlled by ML 14 of the Common Military List, for training in the use of firearms, and specially designed software therefor.

7.Night vision, thermal imaging equipment and image intensifier tubes, other than those controlled by the Common Military List.

8.Razor barbed wire.

9.Military knives, combat knives and bayonets with blade lengths in excess of 10 cm.

9a.Riot control agents, as defined by article 1A004.a.4 of the Commission Delegated Regulation (EU) 2020/1749 of 7 October 2020 amending Council Regulation (EC) No 428/2009 setting up a Community regime for the control of exports, transfer, brokering and transit of dual-use items.

- 10.Production equipment specially designed for the items specified in this list.

- 11.Specific technology for the development, production or use of the items specified in this list.

ANNEX IV

EQUIPMENT, TECHNOLOGY AND SOFTWARE REFERRED TO IN ARTICLES 1c AND 1d

General note

Notwithstanding the contents of this Annex, it shall not apply to:

(a) equipment, technology or software which are specified in Annex I to Council Regulation (EC) No 428/2009 ([^E0017]) or the Common Military List; or

(b) software which is designed for installation by the user without further substantial support by the supplier and which is generally available to the public by being sold from stock at retail selling points, without restriction, by means of:
(i) over the counter transactions;
(ii) mail order transactions;
(iii) electronic transactions; or
(iv) telephone order transactions; or

The categories A, B, C, D and E refer to the categories referred to in Regulation (EC) No 428/2009.

The equipment, technology and software referred to in Articles 1c and 1d is:

A. List of equipment:
— Deep Packet Inspection equipment,
— Network Interception equipment including Interception Management Equipment (IMS) and Data Retention Link Intelligence equipment,
— Radio Frequency monitoring equipment,
— Network and Satellite jamming equipment,
— Remote Infection equipment,
— Speaker recognition/processing equipment,
— IMSI ([^E0018]), MSISDN ([^E0019]), IMEI ([^E0020]), TMSI ([^E0021]) interception and monitoring equipment,
— Systems, equipment, and components therefor, specially designed or modified for the generation, command and control, or delivery of intrusion software as defined in Regulation (EU) 2021/821 of the European Parliament and of the Council ([^E0022]),
— Equipment designed or modified to perform cryptanalysis,
— Tactical SMS ([^E0023]) /GSM ([^E0024]) /GPS ([^E0025]) /GPRS ([^E0026]) /UMTS ([^E0027]) /CDMA ([^E0028]) /PSTN ([^E0029]) interception and monitoring equipment,
— DHCP ([^E0030]) /SMTP ([^E0031]), GTP ([^E0032]) information interception and monitoring equipment,
— Pattern Recognition and Pattern Profiling equipment,
— Remote Forensics equipment,
— Semantic Processing Engine equipment,
— WEP and WPA code breaking equipment,
— Interception equipment for VoIP proprietary and standard protocol.

B. Not used.

C. Not used.

D. "Software" for the "development", "production" or "use" of the equipment specified in point A and "software" having the characteristics of, or performing or simulating, the functions of the equipment specified in point A.

E. "Technology" for the "development", "production" or "use" of the equipment specified in point A.

Equipment, technology and software falling within those categories is within the scope of this Annex only to the extent that it falls within the general description "internet, telephone and satellite communications interception and monitoring systems".

For the purpose of this Annex, "monitoring" means acquisition, extraction, decoding, recording, processing, analysis and archiving call content or network data.

ANNEX V

LIST OF NATURAL OR LEGAL PERSONS, ENTITIES OR BODIES REFERRED TO IN ARTICLES 1e(7), 1f(7), 1fa(1) AND 1fa(1a)

Belarus Ministry of Defence

140 Repair Plant JSC

558 Aircraft Repair Plant JSC

2566 Radioelectronic Armament Repair Plant JSC

AGAT - Control Systems - Managing Company of Geoinformation Control Systems Holding, JSC

AGAT - Electromechanical Plant OJSC

AGAT - SYSTEM

ATE - Engineering LLC

BelOMO Holding

Belspetsvneshtechnika SFTUE

Beltechexport CJSC

BSVT-New Technologies

Department of Internal Affairs of the Gomel Region Executive Committee

Internal Troops of the Ministry of Internal Affairs of the Republic of Belarus

KGB Alpha

Kidma Tech OJSC

Legmash Plant OJSC

Minotor-Service

Minsk Wheeled Tractor Plant

Oboronnye Initsiativy LLC

OJS KB Radar Managing Company

Peleng JSC

State Authority for Military Industry of the Republic of Belarus

State Security Committee of the Republic of Belarus

Transaviaexport Airlines JSC

Volatavto OJSC

CHIP AND DIP LLC

OJSC Rogachev Plant Diaprojector

DISPLAY DESIGN BUREAU JSC

CJSC ‘Hull Products Plant’

ANNEX Va

List of goods and technology referred to in Articles 1f(1) and 1fa(1)

Part A

General Notes, Acronyms and Abbreviations, and Definitions in Annex I to Regulation (EU) 2021/821 apply to this Annex, with the exception of “Part I – General Notes, Acronyms and Abbreviations, and Definitions, General Notes to Annex I, point 2”.

Definitions of Terms used in the Common Military List (CML) of the European Union (C/2024/1945) apply to this Annex.

Without prejudice to Article 1m of this Regulation, non-controlled items containing one or more components listed in this Annex are not subject to the controls under Articles 1f(1) and 1fa(1) of this Regulation.

Category I – Electronics

X.A.I.001 Electronic devices and components.
a. “Microprocessor microcircuits”, “microcomputer microcircuits”, and microcontroller microcircuits having any of the following:
1. A performance speed of 5 GigaFLOPS or more and an arithmetic logic unit with an access width of 32 bit or more;
1. A clock frequency rate exceeding 25 MHz; or
1. More than one data or instruction bus or serial communication port that provides a direct external interconnection between parallel “microprocessor microcircuits” with a transfer rate of 2,5 Mbyte/s;
b. Storage integrated circuits, as follows:
1. Electrically erasable programmable read-only memories (EEPROMs) with a storage capacity;
a. Exceeding 16 Mbits per package for flash memory types; or
b. Exceeding either of the following limits for all other EEPROM types:
1. Exceeding 1 Mbit per package; or
1. Exceeding 256 kbit per package and a maximum access time of less than 80 ns;
1. Static random access memories (SRAMs) with a storage capacity:
a. Exceeding 1 Mbit per package; or
b. Exceeding 256 kbit per package and a maximum access time of less than 25 ns;
c. Analogue-to-digital converters having any of the following:
1. A resolution of 8 bit or more, but less than 12 bit, with an output rate greater than 200 Mega Samples Per Second (MSPS);
1. A resolution of 12 bit with an output rate greater than 105 Mega Samples per Second (MSPS);
1. A resolution of more than 12 bit but equal to or less than 14 bit with an output rate greater than 10 Mega Samples per Second (MSPS); or
1. A resolution of more than 14 bit with an output rate greater than 2,5 Mega Samples Per Second (MSPS);
d. Field programmable logic devices having a maximum number of single-ended digital input/outputs between 200 and 700;
e. Fast Fourier Transform (FFT) processors having a rated execution time for a 1 024 point complex FFT of less than 1 ms;
f. Custom integrated circuits for which the function is unknown, or the control status of the equipment in which the integrated circuits will be used is unknown to the manufacturer, having any of the following:
1. More than 144 terminals; or
1. A typical basic propagation delay time of less than 0,4 ns;
g. Traveling-wave “vacuum electronic devices”, pulsed or continuous wave, as follows:
1. Coupled cavity devices, or derivatives thereof;
1. Devices based on helix, folded waveguide, or serpentine waveguide circuits, or derivatives thereof, having any of the following:
a. An “instantaneous bandwidth” of half an octave or more and average power (expressed in kW) times frequency (expressed in GHz) of more than 0,2 ; or
b. An “instantaneous bandwidth” of less than half an octave; and average power (expressed in kW) times frequency (expressed in GHz) of more than 0,4 ;
h. Flexible waveguides designed for use at frequencies exceeding 40 GHz;
i. Surface acoustic wave and surface skimming (shallow bulk) acoustic wave devices, having either of the following:
1. A carrier frequency exceeding 1 GHz; or
1. A carrier frequency of 1 GHz or less; and
a. A “frequency side-lobe rejection” exceeding 55 dB;
b. A product of the maximum delay time and bandwidth (time in μs and bandwidth in MHz) of more than 100; or
c. A dispersive delay of more than 10 μs; Technical Note: For the purpose of X.A.I.001.i “Frequency side-lobe rejection” is the maximum rejection value specified in data sheet.
j. “Cells” as follows:
1. “Primary cells” having an “energy density” of 550 Wh/kg or less at 293 K (20 ^oC);
1. “Secondary cells” having an “energy density” of 350 Wh/kg or less at 293 K (20 ^oC); Note: X.A.I.001.j does not control batteries, including single cell batteries. Technical Notes:
1. For the purpose of X.A.I.001.j energy density (Wh/kg) is calculated from the nominal voltage multiplied by the nominal capacity in ampere-hours (Ah) divided by the mass in kilograms. If the nominal capacity is not stated, energy density is calculated from the nominal voltage squared then multiplied by the discharge duration in hours divided by the discharge load in Ohms and the mass in kilograms.
2. For the purpose of X.A.I.001.j, a “cell” is defined as an electrochemical device, which has positive and negative electrodes, and electrolyte, and is a source of electrical energy. It is the basic building block of a battery.
3. For the purpose of X.A.I.001.j.1, a “primary cell” is a “cell” that is not designed to be charged by any other source.
4. For the purpose of X.A.I.001.j.2, a “secondary cell” is a “cell” that is designed to be charged by an external electrical source.
k. “Superconductive” electromagnets or solenoids specially designed to be fully charged or discharged in less than one minute, having all of the following: Note: X.A.I.001.k does not control “superconductive” electromagnets or solenoids designed for Magnetic Resonance Imaging (MRI) medical equipment.
1. Maximum energy delivered during the discharge divided by the duration of the discharge of more than 500 kJ per minute;
1. Inner diameter of the current carrying windings of more than 250 mm; and
1. Rated for a magnetic induction of more than 8T or “overall current density” in the winding of more than 300 A/mm²;
l. Circuits or systems for electromagnetic energy storage, containing components manufactured from “superconductive” materials specially designed for operation at temperatures below the “critical temperature” of at least one of their “superconductive” constituents, having all of the following:
1. Resonant operating frequencies exceeding 1 MHz;
1. A stored energy density of 1 MJ/m³ or more; and
1. A discharge time of less than 1 ms;
m. Hydrogen/hydrogen-isotope thyratrons of ceramic-metal construction and rate for a peak current of 500 A or more;
n. Ceramic frequency filters;
o. Solar cells, cell-interconnect-coverglass (CIC) assemblies, solar panels, and solar arrays, which are “space qualified” and not controlled by 3A001.e.4 ([^E0033]);
p. Cermet trimmers;
q. Surface Mounted Device (SMD) inductors.

X.A.I.002 General purpose “electronic assemblies”, modules and equipment.
a. Electronic test equipment, other than those specified in the CML or in Regulation (EU) 2021/821;
b. Digital instrumentation magnetic tape data recorders having any of the following characteristics:
1. A maximum digital interface transfer rate exceeding 60 Mbit/s and employing helical scan techniques;
1. A maximum digital interface transfer rate exceeding 120 Mbit/s and employing fixed head techniques; or
1. “Space qualified”;
c. Equipment, with a maximum digital interface transfer rate exceeding 60 Mbit/s, designed to convert digital video magnetic tape recorders for use as digital instrumentation data recorders;
d. Non-modular analogue oscilloscopes having a bandwidth of 1 GHz or greater;
e. Modular analogue oscilloscope systems having either of the following characteristics:
1. A mainframe with a bandwidth of 1 GHz or greater; or
1. Plug-in modules with an individual bandwidth of 4 GHz or greater;
f. Analogue sampling oscilloscopes for the analysis of recurring phenomena with an effective bandwidth greater than 4 GHz;
g. Digital oscilloscopes and transient recorders, using analogue-to-digital conversion techniques, capable of storing transients by sequentially sampling single-shot inputs at successive intervals of less than 1 ns (greater than 1 Giga Samples per Second (GSPS)), digitising to 8 bits or greater resolution and storing 256 or more samples. Note: X.A.I.002 controls the following specially designed components for analogue oscilloscopes:
1. Plug-in units;
2. External amplifiers;
3. Pre-amplifiers;
4. Sampling devices;
5. Cathode ray tubes.

X.A.I.003 Specific processing equipment, other than those specified in the CML or in Regulation (EU) 2021/821, as follows:
a. Frequency changers and their specially designed components, other than those specified in the CML or in Regulation (EU) 2021/821;
b. Mass spectrometers, other than those specified in the CML or in Regulation (EU) 2021/821;
c. All flash X-ray machines, or components of pulsed power systems designed thereof, including Marx generators, high power pulse shaping networks, high voltage capacitors, and triggers;
d. Pulse amplifiers, other than those specified in the CML or in Regulation (EU) 2021/821;
e. Electronic equipment for time delay generation or time interval measurement, as follows:
1. Digital time delay generators with a resolution of 50 ns or less over time intervals of 1 μs or greater; or
1. Multi-channel (three or more) or modular time interval meter and chronometry equipment with resolution of 50 ns or less over time intervals of 1 μs or greater;
f. Chromatography and spectrometry analytical instruments.

X.B.I.001 Equipment for the manufacture of electronic components or materials, as follows and specially designed components and accessories therefor:
a. Equipment specially designed for the manufacture of electron tubes, optical elements and specially designed components therefor controlled by 3A001 ([^E0034]) or X.A.I.001;
b. Equipment specially designed for the manufacture of semiconductor devices, integrated circuits and “electronic assemblies”, as follows, and systems incorporating or having the characteristics of such equipment: Note: X.B.I.001.b. also controls equipment used or modified for use in the manufacture of other devices, such as imaging devices, electro-optical devices, acoustic-wave devices.
1. Equipment for the processing of materials for the manufacture of devices and components as specified in the heading of X.B.I.001.b, as follows: Note: X.B.I.001 does not control quartz furnace tubes, furnace liners, paddles, boats (except specially designed caged boats), bubblers, cassettes or crucibles specially designed for the processing equipment controlled by X.B.I.001.b.1.
a. Equipment for producing polycrystalline silicon and materials controlled by 3C001 ([^E0035]);
b. Equipment specially designed for purifying or processing III/V and II/VI semiconductor materials controlled by 3C001, 3C002, 3C003, 3C004, or 3C005 ([^E0036]) except crystal pullers, for which see X.B.I.001.b.1.c below;
c. Crystal pullers and furnaces, as follows: Note: X.B.I.001.b.1.c does not control diffusion and oxidation furnaces.
1. Annealing or recrystallizing equipment other than constant temperature furnaces employing high rates of energy transfer capable of processing wafers at a rate exceeding 0,005 m² per minute;
1. “Stored program controlled” crystal pullers having any of the following characteristics:
a. Rechargeable without replacing the crucible container;
b. Capable of operation at pressures above 2,5 x 10⁵ Pa; or
c. Capable of pulling crystals of a diameter exceeding 100 mm;
d. “Stored program controlled” equipment for epitaxial growth having any of the following characteristics:
1. Capable of producing silicon layer with a thickness uniform to less than ±2,5 % across a distance of 200 mm or more;
1. Capable of producing a layer of any material other than silicon with a thickness uniformity across the wafer of equal to or better than ±3,5 %; or
1. Rotation of individual wafers during processing;
e. Molecular beam epitaxial growth equipment;
f. Magnetically enhanced “sputtering” equipment with specially designed integral load locks capable of transferring wafers in an isolated vacuum environment;
g. Equipment specially designed for ion implantation, ion-enhanced or photo-enhanced diffusion, having any of the following characteristics:
1. Patterning capability;
1. Beam energy (accelerating voltage) exceeding 200 keV;
1. Optimised to operate at a beam energy (accelerating voltage) of less than 10 keV; or
1. Capable of high energy oxygen implant into a heated “substrate”;
h. “Stored program controlled” equipment for the selective removal (etching) by means of anisotropic dry methods (e.g., plasma), as follows:
1. “Batch types” having either of the following:
a. End-point detection, other than optical emission spectroscopy types; or
b. Reactor operational (etching) pressure of 26,66 Pa or less;
1. “Single wafer types” having any of the following:
a. End-point detection, other than optical emission spectroscopy types;
b. Reactor operational (etching) pressure of 26,66 Pa or less; or
c. Cassette-to-cassette and load locks wafer handling; Notes: 1.

“Batch types” refers to machines not specially designed for production processing of single wafers. Such machines can process two or more wafers simultaneously with common process parameters, e.g., RF power, temperature, etch gas species, flow rates. 2.

“Single wafer types” refers to machines specially designed for production processing of single wafers. These machines may use automatic wafer handling techniques to load a single wafer into the equipment for processing. The definition includes equipment that can load and process several wafers but where the etching parameters, e.g., RF power or end point, can be independently determined for each individual wafer. - i. Chemical vapour deposition (CVD) equipment, e.g., plasma-enhanced CVD (PECVD) or photo-enhanced CVD, for semiconductor device manufacturing, having either of the following capabilities, for deposition of oxides, nitrides, metals or polysilicon: - 1. Chemical vapour deposition equipment operating below 10⁵ Pa; or - 2. PECVD equipment operating either below 60 Pa or having automatic cassette-to-cassette and load lock wafer handling; Note: X.B.I.001.b.1.i does not control low pressure chemical vapour deposition (LPCVD) systems or reactive “sputtering” equipment. - j. Electron beam systems specially designed or modified for mask making or semiconductor device processing having any of the following characteristics: - 1. Electrostatic beam deflection; - 2. Shaped, non-Gaussian beam profile; - 3. Digital-to-analogue conversion rate exceeding 3 MHz; - 4. Digital-to-analogue conversion accuracy exceeding 12 bit; or - 5. Target-to-beam position feedback control precision of 1 μm or finer; Note: X.B.I.001.b.1.j does not control electron beam deposition systems or general purpose scanning electron microscopes. - k. Surface finishing equipment for the processing of semiconductor wafers as follows: - 1. Specially designed equipment for backside processing of wafers thinner than 100 μm and the subsequent separation thereof; or - 2. Specially designed equipment for achieving a surface roughness of the active surface of a processed wafer with a two-sigma value of 2 μm or less, total indicator reading (TIR); Note: X.B.I.001.b.1.k does not control single-side lapping and polishing equipment for wafer surface finishing. - l. Interconnection equipment which includes common single or multiple vacuum chambers specially designed to permit the integration of any equipment controlled by X.B.I.001 into a complete system; - m. “Stored program controlled” equipment using “lasers” for the repair or trimming of “monolithic integrated circuits” with either of the following characteristics: - 1. Positioning accuracy less than ± 1 μm; or - 2. Spot size (kerf width) less than 3 μm. Technical Note: For the purpose of X.B.I.001.b.1, “sputtering” is an overlay coating process wherein positively charged ions are accelerated by an electric field towards the surface of a target (coating material). The kinetic energy of the impacting ions is sufficient to cause target surface atoms to be released and deposited on the substrate. (Note: Triode, magnetron or radio frequency sputtering to increase adhesion of coating and rate of deposition are ordinary modifications of the process.) - 2. Masks, mask substrates, mask-making equipment and image transfer equipment for the manufacture of devices and components as specified in the heading of X.B.I.001, as follows: Note: The term masks refers to those used in electron beam lithography, X-ray lithography, and ultraviolet lithography, as well as the usual ultraviolet and visible photo-lithography. - a. Finished masks, reticles and designs therefor, except: - 1. Finished masks or reticles for the production of integrated circuits not controlled by 3A001 ([^E0037]); or - 2. Masks or reticles, having both of the following characteristics: - a. Their design is based on geometries of 2,5 μm or more; and - b. The design does not include special features to alter the intended use by means of production equipment or “software”; - b. Mask substrates as follows: - 1. Hard surface (e.g., chromium, silicon, molybdenum) coated “substrates” (e.g., glass, quartz, sapphire) for the preparation of masks having dimensions exceeding 125 mm x 125 mm; or - 2. Substrates specially designed for X-ray masks; - c. Equipment, other than general purpose computers, specially designed for computer aided design (CAD) of semiconductor devices or integrated circuits; - d. Equipment or machines, as follows, for mask or reticle fabrication: - 1. Photo-optical step and repeat cameras capable of producing arrays larger than 100 mm x 100 mm, or capable of producing a single exposure larger than 6 mm x 6 mm in the image (i.e., focal) plane, or capable of producing line widths of less than 2,5 μm in the photoresist on the “substrate”; - 2. Mask or reticle fabrication equipment using ion or “laser” beam lithography capable of producing line widths of less than 2,5 μm; or - 3. Equipment or holders for altering masks or reticles or adding pellicles to remove defects; Note: X.B.I.001.b.2.d.1 and b.2.d.2 do not control mask fabrication equipment using photo-optical methods which was either commercially available before 1 January 1980, or has a performance no better than such equipment. - e. “Stored program controlled” equipment for the inspection of masks, reticles or pellicles with: - 1. A resolution of 0,25 μm or finer; and - 2. A precision of 0,75 μm or finer over a distance in one or two coordinates of 63,5 mm or more; Note: X.B.I.001.b.2.e does not control general purpose scanning electron microscopes except when specially designed and instrumented for automatic pattern inspection. - f. Align and expose equipment for wafer production using photo-optical or X-ray methods, e.g., lithography equipment, including both projection image transfer equipment and step and repeat (direct step on wafer) or step and scan (scanner) equipment, capable of performing any of the following functions: Note: X.B.I.001.b.2.f does not control photo-optical contact and proximity mask align and expose equipment or contact image transfer equipment. - 1. Production of a pattern size of less than 2,5 μm; - 2. Alignment with a precision finer than ±0,25 μm (3 sigma); - 3. Machine-to-machine overlay no better than ±0,3 μm; or - 4. A light source wavelength shorter than 400 nm; - g. Electron beam, ion beam or X-ray equipment for projection image transfer capable of producing patterns less than 2,5 μm; Note: For focused, deflected-beam systems (direct write systems), see X.B.I.001.b.1.j. - h. Equipment using “lasers” for direct write on wafers capable of producing patterns less than 2,5 μm. - 3. Equipment for the assembly of integrated circuits, as follows: - a. “Stored program controlled” die bonders having all of the following characteristics: - 1. Specially designed for “hybrid integrated circuits”; - 2. X-Y stage positioning travel exceeding 37,5 x 37,5 mm; and - 3. Placement accuracy in the X-Y plane of finer than ± 10 μm; - b. “Stored program controlled” equipment for producing multiple bonds in a single operation (e.g., beam lead bonders, chip carrier bonders, tape bonders); - c. Semi-automatic or automatic hot cap sealers, in which the cap is heated locally to a higher temperature than the body of the package, specially designed for ceramic microcircuit packages controlled by 3A001 ([^E0038]) and that have a throughput equal to or more than one package per minute. Note: X.B.I.001.b.3 does not control general purpose resistance type spot welders. - 4. Filters for clean rooms capable of providing an air environment of 10 or less particles of 0,3 μm or smaller per 0,02832 m³ and filter materials therefor. Technical Note: For the purpose of X.B.I.001, “stored program controlled” is a control using instructions stored in an electronic storage that a processor can execute in order to direct the performance of predetermined functions. Equipment may be “stored program controlled” whether the electronic storage is internal or external to the equipment.

X.B.I.002 Equipment for the inspection or testing of electronic components and materials, and specially designed components and accessories therefor.
a. Equipment specially designed for the inspection or testing of electron tubes, optical elements and specially designed components therefor controlled by 3A001 ([^E0039]) or X.A.I.001;
b. Equipment specially designed for the inspection or testing of semiconductor devices, integrated circuits and “electronic assemblies”, as follows, and systems incorporating or having the characteristics of such equipment: Note: X.B.I.002.b also controls equipment used or modified for use in the inspection or testing of other devices, such as imaging devices, electro-optical devices, acoustic-wave devices.
1. “Stored program controlled” inspection equipment for the automatic detection of defects, errors or contaminants of 0,6 μm or less in or on processed wafers, substrates, other than printed circuit boards or chips, using optical image acquisition techniques for pattern comparison; Note: X.B.I.002.b.1 does not control general purpose scanning electron microscopes, except when specially designed and instrumented for automatic pattern inspection.
1. Specially designed “stored program controlled” measuring and analysis equipment, as follows:
a. Specially designed for the measurement of oxygen or carbon content in semiconductor materials;
b. Equipment for line width measurement with a resolution of 1 μm or finer;
c. Specially designed flatness measurement instruments capable of measuring deviations from flatness of 10 μm or less with a resolution of 1 μm or finer.
1. “Stored program controlled” wafer probing equipment having any of the following characteristics:
a. Positioning accuracy finer than 3,5 μm;
b. Capable of testing devices having more than 68 terminals; or
c. Capable of testing at a frequency exceeding 1 GHz;
1. Test equipment as follows:
a. “Stored program controlled” equipment specially designed for testing discrete semiconductor devices and unencapsulated dice, capable of testing at frequencies exceeding 18 GHz; Technical Note: Discrete semiconductor devices include photocells and solar cells.
b. “Stored program controlled” equipment specially designed for testing integrated circuits and “electronic assemblies” thereof, capable of functional testing:
1. At a “pattern rate” exceeding 20 MHz; or
1. At a “pattern rate” exceeding 10 MHz but not exceeding 20 MHz and capable of testing packages of more than 68 terminals. Notes: X.B.I.002.b.4.b does not control test equipment specially designed for testing:
1. Memories;
2. Assemblies or a class of “electronic assemblies” for home and entertainment applications; and
3. Electronic components, “electronic assemblies” and integrated circuits not controlled by 3A001 ([^E0040])or X.A.I.001 provided such test equipment does not incorporate computing facilities with “user accessible programmability”. Technical Note: For purposes of X.B.I.002.b.4.b, “pattern rate” is defined as the maximum frequency of digital operation of a tester. It is therefore equivalent to the highest data rate that a tester can provide in non-multiplexed mode. It is also referred to as test speed, maximum digital frequency or maximum digital speed.
c. Equipment specially designed for determining the performance of focal-plane arrays at wavelengths of more than 1 200 nm, using “stored program controlled” measurements or computer aided evaluation and having any of the following characteristics:
1. Using scanning light spot diameters of less than 0,12 mm;
1. Designed for measuring photosensitive performance parameters and for evaluating frequency response, modulation transfer function, uniformity of responsivity or noise; or
1. Designed for evaluating arrays capable of creating images with more than 32 x 32 line elements;
1. Electron beam test systems designed for operation at 3 keV or below, or “laser” beam systems, for non-contactive probing of powered-up semiconductor devices having any of the following:
a. Stroboscopic capability with either beam blanking or detector strobing;
b. An electron spectrometer for voltage measurements with a resolution of less than 0,5 V; or
c. Electrical tests fixtures for performance analysis of integrated circuits; Note: X.B.I.002.b.5 does not control scanning electron microscopes, except when specially designed and instrumented for non-contactive probing of a powered-up semiconductor device.
1. “Stored program controlled” multifunctional focused ion beam systems specially designed for manufacturing, repairing, physical layout analysis and testing of masks or semiconductor devices and having either of the following characteristics:
a. Target-to-beam position feedback control precision of 1 μm or finer; or
b. Digital-to-analogue conversion accuracy exceeding 12 bit;
1. Particle measuring systems employing “lasers” designed for measuring particle size and concentration in air having both of the following characteristics:
a. Capable of measuring particle sizes of 0,2 μm or less at a flow rate of 0,02832 m³ per minute or more; and
b. Capable of characterizing Class 10 clean air or better. Technical Note: For the purpose of X.B.I.002, “stored program controlled” is a control using instructions stored in an electronic storage that a processor can execute in order to direct the performance of predetermined functions. Equipment may be “stored program controlled” whether the electronic storage is internal or external to the equipment.

X.B.I.003 Equipment for the manufacture of Printed Circuit Boards (PCBs) and specially designed components and accessories therefor, as follows:
a. Film processing equipment;
b. Solder mask coating equipment;
c. Photo plotter equipment;
d. Plating or electroplating deposition equipment;
e. Vacuum chambers and presses;
f. Roll laminators;
g. Alignment equipment; or
h. Etching equipment.

X.B.I.004 Automated optical inspection equipment for testing Printed Circuit Boards (PCBs), based on optical or electrical sensors, and capable to detect any of the following quality defects:
a. Spacing, area, volume or height;
b. Bill boarding;
c. Components (presence, absence, flipped, offset, polarity, or skew);
d. Solder (bridging, insufficient solder joints);
e. Leads (insufficient paste, lifting);
f. Tombstoning; or
g. Electrical (shorts, opens, resistance, capacitance, power, grid performance).

X.C.I.001 Positive resists designed for semiconductor lithography specially adjusted (optimised) for use at wavelengths between 370 and 193 nm.

X.C.I.002 Chemicals and materials of the type used in the production of Printed Circuit Boards (PCBs), as follows:
a. PCB composite substrates made of glass fibre or cotton (e.g. FR-4, FR-2, FR-6, CEM-1, G-10, etc.);
b. Multilayer PCB substrates, containing at least one layer of any of the following materials:
1. Aluminium;
1. Polytetrafluoroethylene (PTFE); or
1. Ceramic materials (e.g. alumina, titanium oxide, etc.);
c. Etchant chemicals:
1. Ferric chloride (7705-08-0);
1. Cupric chloride (7447-39-4);
1. Ammonium persulphate (7727-54-0);
1. Sodium persulphate (7775-27-1); or
1. Chemical preparations specially designed for etching and containing any of the chemicals included in X.C.I.002.c.1 to X.C.I.002.c.4. Note: X.C.I.002.c does not control “chemical mixtures” containing one or more of the chemicals specified in entry X.C.I.002.c in which no individually specified chemical constitutes more than 10 % by the weight of the mixture.
d. Copper foil with a minimum purity 95 % and of a thickness less than 100 μm;
e. Polymeric substances and films thereof of less than 0,5 mm of thickness, as follows:
1. Aromatic polyimides;
1. Parylenes;
1. Benzocyclobutenes (BCBs); or
1. Polybenzoxazoles.

- X.D.I.001 “Software” specially designed for the “development”, “production”, or “use” of electronic devices or components controlled by X.A.I.001, general purpose electronic equipment controlled by X.A.I.002, or manufacturing and test equipment controlled by X.B.I.001 and X.B.I.002; or “software” specially designed for the “use” of equipment controlled by 3B001.g and 3B001.h ([^E0041]).

X.D.I.002 “Software” specially designed for the test, “development” or “production” of Printed Circuit Boards (PCBs).

X.E.I.001 “Technology” for the “development”, “production” or “use” of electronic devices or components controlled by X.A.I.001, general purpose electronic equipment controlled by X.A.I.002, or manufacturing and test equipment controlled by X.B.I.001 or X.B.I.002, or materials controlled by X.C.I.001.

X.E.I.002 “Technology” for the “development”, “production” or “use” of Printed Circuit Boards (PCBs).

Category II – Computers

Note: Category II does not control goods for the personal use of the natural persons.

X.A.II.001 Computers, “electronic assemblies” and related equipment, not controlled by 4A001 or 4A003 ([^E0042]), and specially designed components therefor. Note: The control status of the “digital computers” and related equipment described in X.A.II.001 is determined by the control status of other equipment or systems provided:
a. The “digital computers” or related equipment are essential for the operation of the other equipment or systems;
b. The “digital computers” or related equipment are not a “principal element” of the other equipment or systems; and N.B.1: The control status of “signal processing” or “image enhancement” equipment specially designed for other equipment with functions limited to those required for the other equipment is determined by the control status of the other equipment even if it exceeds the “principal element” criterion. N.B.2: For the control status of “digital computers” or related equipment for telecommunications equipment, see Category 5, Part 1 (Telecommunications) ([^E0043]).
c. The “technology” for the “digital computers” and related equipment is determined by 4E ([^E0044]).
a. Electronic computers and related equipment, and “electronic assemblies” and specially designed components therefor, rated for operation at an ambient temperature above 343 K (70 ^oC);
b. “Digital computers”, including equipment of “signal processing” or “image enhancement”, having an “Adjusted Peak Performance” (“APP”) equal to or greater than 0,0128 Weighted TeraFLOPS (WT);
c. “Electronic assemblies” that are specially designed or modified to enhance performance by aggregation of processors, as follows:
1. Designed to be capable of aggregation in configurations of 16 or more processors;
1. Not used; Note 1: X.A.II.001.c applies only to “electronic assemblies” and programmable interconnections with a “APP” not exceeding the limits in X.A.II.001.b, when shipped as unintegrated “electronic assemblies”. It does not apply to “electronic assemblies” inherently limited by nature of their design for use as related equipment controlled by X.A.II.001.k. Note 2: X.A.II.001.c does not control any “electronic assembly” specially designed for a product or family of products whose maximum configuration does not exceed the limits of X.A.II.001.b.
d. Not used;
e. Not used;
f. Equipment for “signal processing” or “image enhancement” having an “Adjusted Peak Performance” (“APP”) equal to or greater than 0,0128 Weighted TeraFLOPS WT;
g. Not used;
h. Not used;
i. Equipment containing “terminal interface equipment” exceeding the limits in X.A.III.101; Technical Note: For the purpose of X.A.II.001.i, “terminal interface equipment” means equipment at which information enters or leaves the telecommunication system, e.g. telephone, data device, computer, etc.
j. Equipment specially designed to provide external interconnection of “digital computers” or associated equipment that allows communications at data rates exceeding 80 Mbyte/s. Note: X.A.II.001.j does not control internal interconnection equipment (e.g., backplanes, buses) passive interconnection equipment, “network access controllers” or “communication channel controllers”. Technical Note: For the purpose of X.A.II.001.j, “communication channel controllers” is the physical interface which controls the flow of synchronous or asynchronous digital information. It is an assembly that can be integrated into computer or telecommunications equipment to provide communications access.
k. Hybrid computers and “electronic assemblies” and specially designed components therefor containing analogue-to-digital converters having all of the following characteristics:
1. 32 channels or more; and
1. A resolution of 14 bit (plus sign bit) or more with a conversion rate of 200 000 Hz or more.

- X.D.II.001 “Program” proof and validation “software”, “software” allowing the automatic generation of “source codes”, and operating system “software” that are specially designed for “real-time processing” equipment.

a. “Program” proof and validation “software” using mathematical and analytical techniques and designed or modified for “programs” having more than 500 000 “source code” instructions;
b. “Software” allowing the automatic generation of “source codes” from data acquired on line from external sensors described in the Regulation (EU) 2021/821; or
c. Operating system “software” specially designed for “real-time processing” equipment that guarantees a “global interrupt latency time” of less than 20 μs. Technical Note: For the purpose of X.D.II.001, “global interrupt latency time” is the time taken by the computer system to recognise an interrupt due to the event, service the interrupt and perform a context switch to an alternate memory-resident task waiting on the interrupt.

X.D.II.002 “Software” other than that controlled in 4D001 ([^E0045]) specially designed or modified for the “development”, “production” or “use” of equipment controlled by 4A101 ([^E0046]).

X.E.II.001 “Technology” for the “development”, “production” or “use” of equipment controlled by X.A.II.001, or “software” controlled by X.D.II.001 or X.D.II.002.

X.E.II.002 “Technology” for the “development” or “production” of equipment designed for “multi-data-stream processing”. Technical Note: For the purpose of X.E.II.002, “multi-data-stream processing” is a microprogram or equipment architecture technique that permits simultaneous processing of two or more data sequences under the control of one or more instruction sequences by means such as:
1. Single Instruction Multiple Data (SIMD) architectures such as vector or array processors;
2. Multiple Single Instruction Multiple Data (MSIMD) architectures;
3. Multiple Instruction Multiple Data (MIMD) architectures, including those that are tightly coupled, closely coupled or loosely coupled; or
4. Structured arrays of processing elements, including systolic arrays.

Category III. Part 1 – Telecommunications

Note: Category III.Part 1 does not control goods for the personal use of the natural persons.

X.A.III.101 Telecommunication equipment.
a. Any type of telecommunications equipment, not controlled by 5A001.a ([^E0047]), specially designed to operate outside the temperature range from 219 K (– 54 ^oC) to 397 K (124 ^oC).
b. Telecommunication transmission equipment and systems, and specially designed components and accessories therefor, having any of the following characteristics, functions or features: Note: Telecommunication transmission equipment:
a. Categorised as follows, or combinations thereof:
1. Radio equipment (e.g., transmitters, receivers and transceivers);
2. Line terminating equipment;
3. Intermediate amplifier equipment;
4. Repeater equipment;
5. Regenerator equipment;
6. Translation encoders (transcoders);
7. Multiplex equipment (statistical mutiplex included);
8. Modulators/demodulators (modems);
9. Transmultiplex equipment (see CCITT Rec. G701);
10. “Stored program controlled” digital crossconnection equipment;
11. “Gateways” and bridges;
12. “Media access units”; and
b. Designed for use in single or multi-channel communication via any of the following:
1. Wire (line);
2. Coaxial cable;
3. Optical fibre cable;
4. Electromagnetic radiation; or
5. Underwater acoustic wave propagation.
1. Employing digital techniques, including digital processing of analogue signals, and designed to operate at a “digital transfer rate” at the highest multiplex level exceeding 45 Mbit/s or a “total digital transfer rate” exceeding 90 Mbit/s; Note: X.A.III.101.b.1 does not control equipment specially designed to be integrated and operated in any satellite system for civil use.
1. Modems using the “bandwidth of one voice channel” with a “data signalling rate” exceeding 9 600 bits per second;
1. Being “stored program controlled” digital cross connect equipment with “digital transfer rate” exceeding 8,5 Mbit/s per port;
1. Being equipment containing any of the following:
a. “Network access controllers” and their related common medium having a “digital transfer rate” exceeding 33 Mbit/s; or
b. “Communication channel controllers” with a digital output having a “data signalling rate” exceeding 64 000 bit/s per channel; Note: If any uncontrolled equipment contains a “network access controller”, it cannot have any type of telecommunications interface, except those described in, but not controlled by X.A.III.101.b.4.
1. Employing a “laser” and having any of the following characteristics:
a. A transmission wavelength exceeding 1 000 nm; or
b. Employing analogue techniques and having a bandwidth exceeding 45 MHz;
c. Employing coherent optical transmission or coherent optical detection techniques (also called optical heterodyne or homodyne techniques);
d. Employing wavelength division multiplexing techniques; or
e. Performing “optical amplification”;
1. Radio equipment operating at input or output frequencies exceeding:
a. 31 GHz for satellite-earth station applications; or
b. 26,5 GHz for other applications; Note: X.A.III.101.b.6 does not control equipment for civil use when conforming with an International Telecommunications Union (ITU) allocated band between 26,5 GHz and 31 GHz.
1. Being radio equipment employing any of the following:
a. Quadrature-amplitude-modulation (QAM) techniques above level 4 if the “total digital transfer rate” exceeds 8,5 Mbit/s;
b. QAM techniques above level 16 if the “total digital transfer rate” is equal to or less than 8,5 Mbit/s;
c. Other digital modulation techniques and having a “spectral efficiency” exceeding 3 bit/s/Hz; or
d. Operating in the 1,5 MHz to 87,5 MHz band and incorporating adaptive techniques providing more than 15 dB suppression of an interfering signal. Notes: 1.

X.A.III.101.b.7 does not control equipment specially designed to be integrated and operated in any satellite system for civil use.

X.A.III.101.b.7 does not control radio relay equipment for operation in an International Telecommunications Union (ITU) allocated band: - a. Having any of the following: - 1. Not exceeding 960 MHz; or - 2. With a “total digital transfer rate” not exceeding 8,5 Mbit/s; and - b. Having a “spectral efficiency” not exceeding 4 bit/s/Hz. - c. “Stored program controlled” switching equipment and related signalling systems, having any of the following characteristics, functions or features, and specially designed components and accessories therefor: Note: Statistical multiplexers with digital input and digital output which provide switching are treated as “stored program controlled” switches. - 1. “Data (message) switching” equipment or systems designed for “packet-mode operation”, “electronic assemblies” and components therefor, other than those specified in the CML or in Regulation (EU) 2021/821; - 2. Not used; - 3. Routing or switching of “datagram” packets; Note: X.A.III.101.c.3 does not control networks restricted to using only “network access controllers” or to “network access controllers” themselves. - 4. Not used; - 5. Multi-level priority and pre-emption for circuit switching; Note: X.A.III.101.c.5 does not control single-level call preemption. - 6. Designed for automatic hand-off of cellular radio calls to other cellular switches or automatic connection to a centralised subscriber data base common to more than one switch; - 7. Containing “stored program controlled” digital cross connect equipment with “digital transfer rate” exceeding 8,5 Mbit/s per port; - 8. “Common channel signalling” operating in either non-associated or quasi-associated mode of operation; - 9. “Dynamic adaptive routing”; - 10. Being packet switches, circuit switches and routers with ports or lines exceeding any of the following: - a. A “data signalling rate” of 64 000 bit/s per channel for a “communications channel controller”; or Note: X.A.III.101.c.10.a does not control multiplex composite links composed only of communication channels not individually controlled by X.A.III.101.b.1. - b. A “digital transfer rate” of 33 Mbit/s for a “network access controller” and related common media; Note: X.A.III.101.c.10 does not control packet switches or routers with ports or lines not exceeding the limits in X.A.III.101.c.10. - 11. “Optical switching”; - 12. Employing “Asynchronous Transfer Mode” (“ATM”) techniques. - d. Optical fibres and optical fibre cables of more than 50 m in length designed for single mode operation; - e. Centralised network control having all of the following characteristics: - 1. Receives data from the nodes; and - 2. Process these data in order to provide control of traffic not requiring operator decisions, and thereby performing “dynamic adaptive routing”; Note 1: X.A.III.101.e does not include cases of routing decisions taken on predefined information. Note 2: X.A.III.101.e does not preclude control of traffic as a function of predictable statistical traffic conditions. - f. Phased array antennas, operating above 10,5 GHz, containing active elements and distributed components, and designed to permit electronic control of beam shaping and pointing, except for landing systems with instruments meeting International Civil Aviation Organization (ICAO) standards (microwave landing systems (MLS)); - g. Mobile communications equipment other than those specified in the CML or in Regulation (EU) 2021/821, “electronic assemblies” and components therefor; - h. Radio relay communications equipment designed for use at frequencies equal to or exceeding 19,7 GHz and components therefor, other than those specified in the CML or in Regulation (EU) 2021/821; or - i. Video game controllers, gaming controllers, flight simulator controllers, gamepads, joysticks and other input units, for video game consoles or entertainment systems, either corded or cordless. - j. Radio frequency systems and equipment not included in Regulation (EU) 2021/821, components and accessories, specially designed or modified to develop any of the following functions: - a. Take control and command of unmanned aerial vehicles (UAVs); - b. Deliberately and selectively interfere with, deny, inhibit, degrade or deceive radio frequency signals for the control and command of UAVs; - c. Use the specific features of the radio frequency protocol used by UAVs to interfere with their operation. Technical Note: Such systems and equipment may include radio frequency jammers, protocol analysers, signal spoofers, takeover systems, directional antennas, software-defined radio (SDR) platforms, electronic warfare modules, and associated control software or firmware specifically adapted for counter-UAV applications. Technical Note: For the purpose of X.A.III.101: - 1) “Asynchronous transfer mode” (“ATM”) is a transfer mode in which the information is organised into cells; it is asynchronous in the sense that the recurrence of cells depends on the required or instantaneous bit rate. - 2) “Bandwidth of one voice channel” is data communication equipment designed to operate in one voice channel of 3 100 Hz, as defined in CCITT Recommendation G.151. - 3) “Communications channel controller” is the physical interface that controls the flow of synchronous or asynchronous digital information. It is an assembly that can be integrated into computer or telecommunications equipment to provide communications access. - 4) “Datagram” is a self-contained, independent entity of data carrying sufficient information to be routed from the source to the destination data terminal equipment without reliance on earlier exchanges between this source and destination data terminal equipment and the transporting network. - 5) “Fast select” is a facility applicable to virtual calls that allows data terminal equipment to expand the possibility to transmit data in call set-up and clearing “packets” beyond the basic capabilities of a virtual call. - 6) “Gateway” is the function, realised by any combination of equipment and “software”, to carry out the conversion of conventions for representing, processing or communicating information used on one system into the corresponding, but different conventions used in another system. - 7) “Integrated Services Digital Network” (ISDN) is a unified end- to-end digital network, in which data originating from all types of communication (e.g., voice, text, data, still and moving pictures) are transmitted from one port (terminal) in the exchange (switch) over one access line to and from the subscriber. - 8) “Packet” is a group of binary digits including data and call control signals that is switched as a composite whole. The data, call control signals, and possible error control information are arranged in a specified format. - 9) “Common channel signalling” means the transmission of control information (signalling) via a separate channel than that used for the messages. The signalling channel usually controls multiple message channels. - 10) “Data signalling rate” means the rate, as defined in ITU Recommendation 53-36, taking into account that, for non-binary modulation, baud and bit per second are not equal. Bits for coding, checking and synchronization functions are to be included. - 11) “Dynamic adaptive routing” means Automatic rerouting of traffic based on sensing and analysis of current actual network conditions. - 12) “Media access unit” means equipment that contains one or more communication interfaces (“network access controller”, “communications channel controller”, modem or computer bus) to connect terminal equipment to a network. - 13) “Spectral efficiency” is the “digital transfer rate” [bits/s] / 6 dB spectrum bandwidth in Hz. - 14) “Stored program controlled” is a control using instructions stored in an electronic storage that a processor can execute in order to direct the performance of predetermined functions. Note: Equipment may be “stored program controlled” whether the electronic storage is internal or external to the equipment.

X.B.III.101 Telecommunications test equipment, other than those specified in the CML or in Regulation (EU) 2021/821.

X.C.III.101 Preforms of glass or of any other material optimised for the manufacture of optical fibres controlled by X.A.III.101.

X.D.III.101 “Software” specially designed or modified for the “development”, “production” or “use” of equipment controlled by X.A.III.101 and X.B.III.101, and dynamic adaptive routing “software” as described as follows:
a. “Software”, other than in machine-executable form, specially designed for “dynamic adaptive routing”;
b. Not used.

- X.E.III.101 “Technology” for the “development”, “production” or “use” of equipment controlled by X.A.III.101 or X.B.III.101, or “software” controlled by X.D.III.101, and other “technologies” as follows:

a. Specific “technologies” as follows:
1. “Technology” for the processing and application of coatings to optical fibre specially designed to make it suitable for underwater use;
1. “Technology” for the “development” of equipment employing “Synchronous Digital Hierarchy” (“SDH”) or “Synchronous Optical Network” (“SONET”) techniques. Technical Note: For the purpose of X.E.III.101:
1) “Synchronous digital hierarchy” (SDH) is a digital hierarchy providing a means to manage, multiplex, and access various forms of digital traffic using a synchronous transmission format on different types of media. The format is based on the Synchronous Transport Module (STM) that is defined by CCITT Recommendation G.703, G.707, G.708, G.709 and others yet to be published. The first level rate of “SDH” is 155,52 Mbits/s.
2) “Synchronous optical network” (SONET) is a network providing a means to manage, multiplex and access various forms of digital traffic using a synchronous transmission format on fibre optics. The format is the North America version of “SDH” and also uses the Synchronous Transport Module (STM). However, it uses the Synchronous Transport Signal (STS) as the basic transport module with a first level rate of 51,81 Mbits/s. The SONET standards are being integrated into those of “SDH”.

Category III. Part 2 – Information Security

Note: Category III. Part 2 does not control goods for the personal use of the natural persons.

X.A.III.201 Equipment as follows:
a. Not used;
b. Not used;
c. Goods classified as mass market encryption in accordance with Cryptography Note – Note 3 to Category 5, Part 2 ([^E0048]).

X.D.III.201 “Information Security” “software” as follows: Note: This entry does not control “software” designed or modified to protect against malicious computer damage, e.g., viruses, where the use of “cryptography” is limited to authentication, digital signature and/or the decryption of data or files.
a. Not used;
b. Not used;
c. “Software” classified as mass market encryption “software” in accordance with Cryptography Note – Note 3 to Category 5, Part 2 ([^E0049]).

X.E.III.201 “Information Security” “technology” according to the General Technology Note, as follows:
a. Not used;
b. “Technology”, other than specified in the CML or in Regulation (EU) 2021/821, for the “use” of mass market goods controlled by X.A.III.201.c or mass market “software” controlled by X.D.III.201.c.

Category IV – Sensors and Lasers

X.A.IV.001 Marine or terrestrial acoustic equipment, capable of detecting or locating underwater objects or features or positioning surface vessels or underwater vehicles; and specially designed components, other than those specified in the CML or in Regulation (EU) 2021/821.

X.A.IV.002 Optical Sensors as follows:
a. Image intensifier tubes and specially designed components therefor, as follows:
1. Image intensifier tubes having all the following:
a. A peak response in wavelength range exceeding 400 nm, but not exceeding 1 050 nm;
b. A microchannel plate for electron image amplification with a hole pitch (centre-to-centre spacing) of less than 25 μm; and
c. Having any of the following:
1. An S-20, S-25 or multialkali photocathode; or
1. A GaAs or GaInAs photocathode;
1. Specially designed microchannel plates having both of the following characteristics:
a. 15 000 or more hollow tubes per plate; and
b. Hole pitch (centre-to-centre spacing) of less than 25 μm.
b. Direct view imaging equipment operating in the visible or infrared spectrum, incorporating image intensifier tubes having the characteristics listed in X.A.IV.002.a.1.

X.A.IV.003 Cameras as follows:
a. Cameras that meet the criteria of Note 3 to 6A003.b.4. ([^E0050]);
b. Not used;

X.A.IV.004 Optics as follows: Note: X.A.IV.004 does not control optical filters with fixed air gaps or Lyot-type filters.
a. Optical filters:
1. For wavelengths longer than 250 nm, comprised of multi-layer optical coatings and having either of the following:
a. Bandwidths equal to or less than 1 nm Full Width Half Intensity (FWHI) and peak transmission of 90 % or more; or
b. Bandwidths equal to or less than 0,1 nm FWHI and peak transmission of 50 % or more;
1. For wavelengths longer than 250 nm, and having all of the following:
a. Tunable over a spectral range of 500 nm or more;
b. Instantaneous optical bandpass of 1,25 nm or less;
c. Wavelength resettable within 0,1 ms to an accuracy of 1 nm or better within the tunable spectral range; and
d. A single peak transmission of 91 % or more;
1. Optical opacity switches (filters) with a field of view of 30^o or wider and a response time equal to or less than 1 ns;
b. “Fluoride fibre” cable, or optical fibres therefor, having an attenuation of less than 4 dB/km in the wavelength range exceeding 1 000 nm but not exceeding 3 000 nm; Technical Note: For the purpose of X.A.IV.004.b “Fluoride fibres” are fibres manufactured from bulk fluoride compounds.

Reading this document does not replace reading the official text published in the Official Journal of the European Union. We assume no responsibility for any inaccuracies arising from the conversion of the original to this format.

This text is published under EUR-Lex's own terms of reuse, not a Legalize or public-domain licence. EUR-Lex
Creative Commons Attribution 4.0 International (CC BY 4.0)
© European Union, https://eur-lex.europa.eu — Source: EUR-Lex (Publications Office of the European Union). Reused under the Creative Commons Attribution 4.0 International (CC BY 4.0) licence. Only EU legislation published in the printed Official Journal of the European Union is deemed authentic; consolidated texts are reproduced here for documentation purposes and have been reformatted to Markdown.